Mikros Technologies and Carbice Corporation transplant cooling technologies originally designed for the International Space Station to resolve severe heat dissipation troubles inside AI data centers.

Aerospace-level cooling technology serves high-performance AI computing equipment

Severe chip overheating often leads to server performance throttling and unexpected outages, bringing huge hourly economic losses. More enterprises are shifting from traditional air cooling to high-efficiency liquid cooling solutions.

The two firms have established in-depth cooperation with Broadcom, Marvell and other mainstream chip manufacturers. Their mature thermal interface materials and microchannel cooling structures can perfectly adapt to high-power AI chips, effectively boost equipment stability and reduce overall energy consumption.

Carbice’s carbon nanotube thermal products also gain wide recognition in consumer electronics and server fields, and the company is expanding production capacity to meet fast-growing market demands.